特集 エレクトロニク...

特集 エレクトロニクス実装技術の現状と展望

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特集 エレクトロニクス実装技術の現状と展望

Call No. (NDL)
Z74-B258
Bibliographic ID of National Diet Library
9786446
Material type
記事
Author
-
Publisher
東京 : エレクトロニクス実装学会
Publication date
2009-01
Material Format
Paper
Journal name
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 12(1) (通号 77) 2009.1
Publication Page
p.1~45
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Paper

Material Type
記事
Alternative Title
Special articles: Electronics packaging technology: the current status and perspective
Periodical title
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue
12(1) (通号 77) 2009.1
Volume
12
Issue
1
Sequential issue number
77
Pages
1~45
Publication date of volume/issue (W3CDTF)
2009-01