部品内蔵基板の生産性向上に繋がる解析関連技術 (特集 エレクトロニクス実装技術の現状と展望)
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- Material Type
- 記事
- Author/Editor
- 部品内蔵技術委員会
- Series Title
- Author Heading
- Alternative Title
- EDA Technology of Challenge for Productivity of Device Embedded Substrate
- Periodical title
- エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
- No. or year of volume/issue
- 20(1)=133:2017.1
- Volume
- 20
- Issue
- 1
- Sequential issue number
- 133
- Pages
- 57-61
- Publication date of volume/issue (W3CDTF)
- 2017-01
- ISSN (Periodical Title)
- 1343-9677
- ISSN-L (Periodical Title)
- 1343-9677
- Publication (Periodical Title)
- 東京 : エレクトロニクス実装学会
- Place of Publication (Country Code)
- JP
- Text Language Code
- jpn
- NDLC
- Target Audience
- 一般
- Holding library
- 国立国会図書館
- Call No.
- Z74-B258
- Data Provider (Database)
- 国立国会図書館 : 国立国会図書館雑誌記事索引
- Bibliographic ID (NDL)
- 027845487
- Bibliographic Record Category (NDL)
- 632
- DOI
- 10.5104/jiep.20.57
- Access Restrictions
- インターネット公開
- Data Provider (Database)
- 科学技術振興機構 : J-STAGE
- DOI
- 10.5104/jiep.20.57
- Related Material (URI)
- References
- Removing Nuclear Weapons from Turkey部品内蔵基板の検査方法の提案プリント回路板における検査のあり方と問題DfTの実践事例システムJisso-CAD/CAEの課題と展望
- Data Provider (Database)
- 国立情報学研究所 : CiNii Research
- Original Data Provider (Database)
- Japan Link Center雑誌記事索引データベースCrossrefCiNii Articles
- Bibliographic ID (NDL)
- 027845487
- NAID
- 130005530013