パワーデバイス用高温鉛はんだにおける接合プロセスと強度の関係

Holdings of Libraries in Japan

This page shows libraries in Japan other than the National Diet Library that hold the material.

Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.

other

J-STAGE
Digital
J-STAGE
CiNii Research
Search Service
Digital
You can check the holdings of institutions and databases with which CiNii Research is linked at the site of CiNii Research.
Check the holdings of this book

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Material Type: 記事
Title: パワーデバイス用高温鉛はんだにおける接合プロセスと強度の関係
Author/Editor: 弓場敦司
松尾朋郎
池部旭
池田徹
小金丸正明
苅谷健人
眞砂紀之
浮田昌也
Author Heading: 弓場敦司
松尾朋郎
池部旭
池田徹
小金丸正明
苅谷健人
眞砂紀之
浮田昌也
Alternative Title: Relationship between Bonding Processes of High-temperature Lead Solders in Power Devices and their Strength
Periodical title: マイクロエレクトロニクスシンポジウム論文集
No. or year of volume/issue: 30:2020.9.17・18
Volume: 30
Pages: 13-16
Publication date of volume/issue (W3CDTF): 2020-09
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-1617
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 031962765
http://id.ndl.go.jp/bib/031962765
Bibliographic Record Category (NDL): 632