Cu/Ni-P/Sn-5Sb-0.7Cuはんだ接合部エレクトロマイグレーションの電流密度加速性

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Material Type: 記事
Title: Cu/Ni-P/Sn-5Sb-0.7Cuはんだ接合部エレクトロマイグレーションの電流密度加速性
Author/Editor: 和田有史
小黒航平
長谷川就大
山中公博
Author Heading: 和田有史
小黒航平
長谷川就大
山中公博
Alternative Title: Current Density Acceleration of Electromigration on Cu/Ni-P/Sn-5Sb-0.7Cu Solder Joint
Periodical title: マイクロエレクトロニクスシンポジウム論文集
No. or year of volume/issue: 32:2022.9.5-7
Volume: 32
Pages: 145-148
Publication date of volume/issue (W3CDTF): 2022-09
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-1617
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 033132168
http://id.ndl.go.jp/bib/033132168
Bibliographic Record Category (NDL): 632