Low Temperature and Low Pressure Bonding of Power Module and Copper Heat Spreader by Transient Liquid Phase Sintering

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Low Temperature and Low Pressure Bonding of Power Module and Copper Heat Spreader by Transient Liquid Phase Sintering

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Material Type: 博士論文
Title: Low Temperature and Low Pressure Bonding of Power Module and Copper Heat Spreader by Transient Liquid Phase Sintering
Author/Editor: ムハマド, ハイリファイズ
Muhammad, Khairi Faiz
Author Heading: ムハマド, ハイリファイズ
Muhammad, Khairi Faiz
Publication Date: 2017
Publication Date (W3CDTF): 2017
Alternative Title: 過度液相焼結法によるパワーモジュールと銅ヒートスプレッダの低温及び低圧力接合
Pages: 1-215
Degree grantor/type: 早稲田大学
Date Granted: 2017-10-26
Dissertation Number: 甲第5273号
Degree Type: 博士（工学）
Text Language Code: eng
Target Audience: 一般
Note (General): 早大学位記番号:新7685
Format (IMT): application/pdf
Source: Honbun-7685.pdf （fulltext）
https://waseda.repo.nii.ac.jp/record/41290/files/Honbun-7685.pdf
Access Restrictions: インターネット公開
Data Provider (Database): 国立情報学研究所 : 学術機関リポジトリデータベース（IRDB）（機関リポジトリ）
https://irdb.nii.ac.jp
Original Data Provider (Database): 早稲田大学 : 早稲田大学リポジトリ