A Study on Microwave Nondestructive Evaluation of Delamination in IC Package(マイクロ波による電子パッケージ内のはく離の非破壊評価に関する研究)

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Note (General)：: application/pdf博士学位論文の要旨及び審査結果の要旨 (Summary of Thesis(DR))388334 bytes...

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Material Type: 文書・図像類
Title: A Study on Microwave Nondestructive Evaluation of Delamination in IC Package(マイクロ波による電子パッケージ内のはく離の非破壊評価に関する研究)
Author/Editor: 巨, 陽
Author Heading: 巨, 陽
Publication Date: 1998
Publication Date (W3CDTF): 1998
No. or year of volume/issue: 2227
Issue: 2227
Text Language Code: jpn
Target Audience: 一般
Note (General): application/pdf
博士学位論文の要旨及び審査結果の要旨 (Summary of Thesis(DR))
388334 bytes
T1H102227
Access Restrictions: 限定公開
Data Provider (Database): 国立情報学研究所 : 学術機関リポジトリデータベース（IRDB）（機関リポジトリ）
https://irdb.nii.ac.jp
Original Data Provider (Database): 東北大学 : 東北大学機関リポジトリ　TOUR