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文書・図像類

Integrated Tactile Sensors with LSI Diaphragm Flip-bonded to LTCC Via-Wafer for Robots

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Integrated Tactile Sensors with LSI Diaphragm Flip-bonded to LTCC Via-Wafer for Robots

Material type
文書・図像類
Author
浅野, 翔
Publisher
-
Publication date
-
Material Format
Digital
Capacity, size, etc.
-
NDC
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Note (General):

博士学位論文の要旨及び審査結果の要旨 (Summary of Thesis(DR))

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  • Tohoku University Repository(TOUR)

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Digital

Material Type
文書・図像類
Author/Editor
浅野, 翔
Author Heading
Alternative Title
LTCCビアウェハにフリップ接合されたLSIダイヤフラムを有するロボット用集積化触覚センサ
No. or year of volume/issue
62
Issue
62
Text Language Code
eng
Target Audience
一般
Note (General)
博士学位論文の要旨及び審査結果の要旨 (Summary of Thesis(DR))