半導体パッケージにおけるエポキシ樹脂と金属表面の接着界面に関する理論的研究

Name of awarding university/degree: 九州大学,博士（工学）,DOCTOR OF PHILOSOPHY IN ENGINEERING

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Material Type: 博士論文
Title: 半導体パッケージにおけるエポキシ樹脂と金属表面の接着界面に関する理論的研究
Author/Editor: 鶴見, 直明
Author Heading: 鶴見, 直明ツルミ, ナオアキ
Publication Date: 2021-09-24
Publication Date (W3CDTF): 2021-09-24
Alternative Title: Theoretical Study of Adhesive Interfaces between Epoxy Resin and Metal Surface in Semiconductor Packages
Contributor: 吉澤, 一成
田中, 賢
田中, 敬二
Degree grantor/type: 九州大学
Date Granted: 2021-09-24
Dissertation Number: 17102甲第15730号
Degree Type: 博士（工学）
DOCTOR OF PHILOSOPHY IN ENGINEERING
Text Language Code: eng
Target Audience: 一般
Note (General): 主1
Rights (production): やむを得ない事由により本文ファイル非公開 (3)
Public access to the fulltext file is restricted for unavoidable reason (3)
Data Provider (Database): 国立情報学研究所 : 学術機関リポジトリデータベース（IRDB）（機関リポジトリ）
https://irdb.nii.ac.jp
Original Data Provider (Database): 九州大学 : 九州大学学術情報リポジトリ