高分子スパッタ膜と金属との付着性に関する研究

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Author: 山田, 良穂ほか

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Publication date: 1991-03-01

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Note (General)：: 金沢大学工学部1.スパッタリング法により各種高分子薄膜を基板(ガラス、Cu、Ni)上に作成し、表面形状測定およびSEM観察により、膜質と成膜過程を検討した。主にPTFEスパッタ膜について、生成膜の分子構造をESCAにより検討するとともに、膜の剥離強度の検討のために定荷重繰り返し引っかき試験、および荷...

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Material Type: 文書・図像類
Title: 高分子スパッタ膜と金属との付着性に関する研究
Author/Editor: 山田, 良穂
Yamada, Yoshinori
Author Heading: 山田, 良穂
Yamada, Yoshinori
Publication Date: 1991-03-01
Publication Date (W3CDTF): 1991-03-01
Alternative Title: Adhesion Between Sputter-Deposited Polymer Films and Metal Substrates
Periodical title: 平成2(1990)年度科学研究費補助金一般研究(C) 研究成果報告書 = 1990 Fiscal Year Final Research Report
No. or year of volume/issue: 1989-1990
Volume: 1989-1990
Pages: 108p.-
Text Language Code: jpn
Subject Heading: 高分子薄膜
RFスパッタリング
AE信号
ESCA
引っかき試験
摩擦耐久性
引っ張り法
付着強度
Thin polymer film
RF-sputtering
AE event
Scratch test
Frictional durability
Tensile pull test
Adhesion strength
Target Audience: 一般
Note (General): 金沢大学工学部
1.スパッタリング法により各種高分子薄膜を基板(ガラス、Cu、Ni)上に作成し、表面形状測定およびSEM観察により、膜質と成膜過程を検討した。主にPTFEスパッタ膜について、生成膜の分子構造をESCAにより検討するとともに、膜の剥離強度の検討のために定荷重繰り返し引っかき試験、および荷重一様増加形単一引っかき試験により、それぞれ膜の剥離の生じる臨界引っかき回数と臨界荷重を測定した。さらに引っ張り法により金属蒸着膜との付着強度を測定し、膜質との関係を検討した。 2.(1)成膜速度は蒸着法に劣るが、スパッタ膜の膜質(表面平滑性、ピンホ-ルフリ-)は優る。(2)スパッタPTFE膜の組成、分子構造はバルク材とは異なり、また成膜条件(放電時圧力、電力)にも依存する。PTFEの場合、ESCAによりスパッタ膜ではバルク材よりF原子が減少し、4成分の重畳したブロ-ドなClsスペクトルが観測され、分子末端、分枝、架橋の多い分子構造であると推定される。(3)両引っかき試験において、膜の剥離損傷とAE信号、摩擦力の変動との対応関係があり、AE信号の検出により簡便に膜の剥離を検出できる。(4)単一引っかきによるスパッタ膜の付着性(剥離の臨界荷重)は高分子材種、成膜条件、基板種に依存するが、基板硬度の違いの影響のため破断剥離モ-ドが異なる。(5)繰り返し引っかきでの膜剥離発生の臨界回転数(摩擦耐久性)は基板種、成膜条件に依存し、Ni基板上の膜がCu基板上よりよい。また、摩擦耐久性、臨界荷重とも高電力、低圧力で成膜した膜で大きい。(6)引っ張り法による金属蒸着膜との付着強度は、Au以外の場合、スパッタ膜面ではバルク表面でより増加し、その増加割合及び付着強度はAu、Al、Cu、Cr、Niの順に大きい。また、低圧力で成膜した膜の付着強度が大きい。 3.膜の剥離強度、付着強度に関する以上の結果は、高分子種、成膜条件に依存する膜の分子構造の違いに起因する。
1. Thin polymer films were deposited on kinds of substrates (glass, copper and nickel plates) by RF-sputtering various polymers. The surface texture and the deposition process of the films were examined by means of SEM and non-contacting profilometer. Especially, with the sputter-deposited PTFE films, molecular structure of the film were examined by ESCA, and to investigate the adhesion between the films and some metals, critical disk revolutions (frictional durability) and critical load were measured by means of a multipleーscratch test under a constant load and a single-scratch test under a load increasing at a constant rate, respectively. In addition to these scratch tests, the tensile pull test was also carried out. 2. (1) Although the film deposition rate by sputtering technique was lower than that by vacuum evaporation technique, the quality (surface roughness, pinーhole free) of the sputter-deposited films were superior to that of evaporated films. (2) The fluorine content of the sputter-deposited PTFE was lower than that of bulk PTFE, and depend on the sputtering condition. C_<1sn> ESCA spectrum of sputter-deposited PTFE films exhibited very broad spectrum band composed of four components in contrast to a narrow single spectrum of bulk PTFE. The ESCA results suggested that the molecular chains of the sputter-deposited PTFE film had many branches and crosslinks and/or lower molecular weight than those of bulk PTFE. (3) Under the two types of scratch tests, the variation of friction force and AE event count rate were observedcorres ponding to an initiation of the film damage. (4) The critical disk devolution and the critical load were depend on the type of the polymer films, sputtering conditions and the type of the substrate. (5) The adhesion between the sputter-deposited PTFE films and the evaporated metal films were higher than that between bulk PTFE and the evaporated metal films, and the films deposited under a lower pressure exhibited higher adhesion to the evaporated metal films than the films deposited under a higher pressure.
研究課題/領域番号:01550056, 研究期間(年度):1989–1990
出典：「高分子スパッタ膜と金属との付着性に関する研究」研究成果報告書　課題番号01550056 (KAKEN：科学研究費助成事業データベース（国立情報学研究所）)　　　本文データは著者版報告書より作成
Access Restrictions: 限定公開
Related Material: https://kaken.nii.ac.jp/search/?qm=20126626
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-01550056/
https://kaken.nii.ac.jp/report/KAKENHI-PROJECT-01550056/015500561990kenkyu_seika_hokoku_gaiyo/
Data Provider (Database): 国立情報学研究所 : 学術機関リポジトリデータベース（IRDB）（機関リポジトリ）
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Original Data Provider (Database): 金沢大学 : 金沢大学学術情報リポジトリKURA