巨大ひずみ加工による結晶粒超微細化強化と析出強化の同時利用の実現

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Author: 渡邊, 千尋ほか

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Publication date: 2016-06-27

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Note (General)：: 金沢大学理工研究域機械工学系各種析出強化型銅合金に，高圧ねじり（HPT）加工を施し，加工硬化量及び，時効硬化挙動に付いて系統的な調査を行った．HPT加工による到達最高硬さ，及び続く時効強化挙動に及ぼす加工温度の影響を明らかにした．さらに，HPT加工後の自然時効が，続く人工時効に及ぼす影響についても明...

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https://kaken.nii.ac.jp/search/?qm=60345600

https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-25420775/

https://kaken.nii.ac.jp/report/KAKENHI-PROJECT-25420775/25420775seika/

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Material Type: 文書・図像類
Title: 巨大ひずみ加工による結晶粒超微細化強化と析出強化の同時利用の実現
Author/Editor: 渡邊, 千尋
Watanabe, Chihiro
Author Heading: 渡邊, 千尋
Watanabe, Chihiro
Publication Date: 2016-06-27
Publication Date (W3CDTF): 2016-06-27
Alternative Title: Concurrently strengthened severely deformed metallic materials by ultra-fine grained and precipitation hardenings
Periodical title: 平成27(2015)年度科学研究費補助金基盤研究(C) 研究成果報告書 = 2015 Fiscal Year Final Research Report
No. or year of volume/issue: 2013-04-01 - 2016-03-31
Volume: 2013-04-01 - 2016-03-31
Pages: 5p.-
Text Language Code: jpn
Subject Heading: 巨大ひずみ加工
高圧ねじり加工
析出強化型銅合金
結晶粒微細化
Target Audience: 一般
Note (General): 金沢大学理工研究域機械工学系
各種析出強化型銅合金に，高圧ねじり（HPT）加工を施し，加工硬化量及び，時効硬化挙動に付いて系統的な調査を行った．HPT加工による到達最高硬さ，及び続く時効強化挙動に及ぼす加工温度の影響を明らかにした．さらに，HPT加工後の自然時効が，続く人工時効に及ぼす影響についても明らかにした．以上の結果は，巨大ひずみ加工による結晶粒超微細化と析出強化の重畳の実現へ新たな知見を与えるものである．
The microstructure and aging behavior in Cu based age-hard enable alloys processed by high-pressure torsion (HPT) were systematically investigated. The effects of processing temperature on attainable maximum hardness by HPT and age-hardening behavior of the alloys after HPT were clearly explained. Moreover, the influence of natural aging on the artificial aging behavior of Cu-Be and Cu-T alloys systems were discussed. The obtained results in this study shed light on strengthening of the metallic materials by grain-refinement strengthening and precipitation hardening simultaneously.
研究課題/領域番号:25420775, 研究期間(年度):2013-04-01 - 2016-03-31
DOI: 10.24517/00052190
Access Restrictions: 限定公開
Related Material: https://kaken.nii.ac.jp/search/?qm=60345600
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-25420775/
https://kaken.nii.ac.jp/report/KAKENHI-PROJECT-25420775/25420775seika/
Data Provider (Database): 国立情報学研究所 : 学術機関リポジトリデータベース（IRDB）（機関リポジトリ）
https://irdb.nii.ac.jp
Original Data Provider (Database): 金沢大学 : 金沢大学学術情報リポジトリKURA