文書・図像類

SOIデバイスを用いた宇宙用半導体部品の開発

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SOIデバイスを用いた宇宙用半導体部品の開発

Material type
文書・図像類
Author
小林, 大輔ほか
Publisher
宇宙航空研究開発機構
Publication date
2006-11-01
Material Format
Digital
Capacity, size, etc.
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Note (General):

This paper describes a brief overview and research results of ISAS/MHI (Mitsubishi Heavy Industries) space-application microelectronics development pr...

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Digital

Material Type
文書・図像類
Author/Editor
小林, 大輔
福田, 盛介
廣瀬, 和之
齋藤, 宏文
Kobayashi, Daisuke
Fukuda, Seisuke
Hirose, Kazuyuki
Saito, Hirobumi
Publication, Distribution, etc.
Publication Date
2006-11-01
Publication Date (W3CDTF)
2006-11-01
Alternative Title
Development of space-application microelectronics employing silicon-on-insulator semiconductor devices
Periodical title
宇宙航空研究開発機構特別資料: 平成18年度 宇宙航空研究開発機構 総合技術研究本部 宇宙科学研究本部 研究成果報告書 = JAXA Special Publication: Report on Research Achievements for FY2006 Institute of Space and Astronautical Science, Institute of Aerospace Technology, Japan Aerospace Exploration Agency
No. or year of volume/issue
JAXA-SP-06-006