Evaluation of Ceramic BGA Package Solder-Joint-Reliability With a View to Space Applications

Material type: 文書・図像類

Author: 徳江, 喜泰ほか

Publisher: 宇宙航空研究開発機構研究開発本部電子部品・デバイス・材料グループ(JAXA)

Publication date: 2010-11-10

Material Format: Paper

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Note (General)：: 第23回マイクロエレクトロニクスワークショップ(MEWS23) (2010年11月10日-11日. つくば国際会議場), つくば市, 茨城The 23rd Microelectronics Workshop (MEWS23) (Nobember 10-11, 2010. Tsukuba Intern...

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Paper

Material Type: 文書・図像類
Title: Evaluation of Ceramic BGA Package Solder-Joint-Reliability With a View to Space Applications
Author/Editor: 徳江, 喜泰
中川, 剛
根本, 規生
篠崎, 孝一
南, 海音子
Tokue, Yoshihiro
Nakagawa, Tsuyoshi
Nemoto, Norio
Shinozaki, Koichi
Minami, Mineko
Author Heading: 徳江, 喜泰
中川, 剛
根本, 規生
篠崎, 孝一
南, 海音子
Tokue, Yoshihiro
Nakagawa, Tsuyoshi
Nemoto, Norio
Shinozaki, Koichi
Minami, Mineko
Publication, Distribution, etc.: 宇宙航空研究開発機構研究開発本部電子部品・デバイス・材料グループ(JAXA)
Publication Date: 2010-11-10
Publication Date (W3CDTF): 2010-11-10
Pages: 1-26
Text Language Code: eng
Target Audience: 一般
Note (General): 第23回マイクロエレクトロニクスワークショップ(MEWS23) (2010年11月10日-11日. つくば国際会議場), つくば市, 茨城
The 23rd Microelectronics Workshop (MEWS23) (Nobember 10-11, 2010. Tsukuba International Congress Center), Tsukuba, Ibaraki, Japan
形態: カラー図版あり
Physical characteristics: Original contains color illustrations
資料番号: AD1710002016
Related Material: https://eeepitnl.tksc.jaxa.jp/mews/EN/23rd/presentation_e.htm
Data Provider (Database): 国立情報学研究所 : 学術機関リポジトリデータベース（IRDB）（機関リポジトリ）
https://irdb.nii.ac.jp
Original Data Provider (Database): 宇宙航空研究開発機構 : 宇宙航空研究開発機構リポジトリ