Thermal characteristics analysis for reliability improvement of electronic equipment

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Note (General)：: 第23回マイクロエレクトロニクスワークショップ(MEWS23) (2010年11月10日-11日. つくば国際会議場), つくば市, 茨城The 23rd Microelectronics Workshop (MEWS23) (Nobember 10-11, 2010. Tsukuba Intern...

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https://eeepitnl.tksc.jaxa.jp/mews/EN/23rd/presentation_e.htm

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Material Type: 文書・図像類
Title: Thermal characteristics analysis for reliability improvement of electronic equipment
Author/Editor: 清水, 亙
Shimizu, Wataru
Author Heading: 清水, 亙
Shimizu, Wataru
Publication, Distribution, etc.: 宇宙航空研究開発機構研究開発本部電子部品・デバイス・材料グループ(JAXA)
Publication Date: 2010-11-10
Publication Date (W3CDTF): 2010-11-10
Pages: 1-25
Text Language Code: eng
Target Audience: 一般
Note (General): 第23回マイクロエレクトロニクスワークショップ(MEWS23) (2010年11月10日-11日. つくば国際会議場), つくば市, 茨城
The 23rd Microelectronics Workshop (MEWS23) (Nobember 10-11, 2010. Tsukuba International Congress Center), Tsukuba, Ibaraki, Japan
形態: カラー図版あり
Physical characteristics: Original contains color illustrations
資料番号: AD1710002018
Related Material: https://eeepitnl.tksc.jaxa.jp/mews/EN/23rd/presentation_e.htm
Data Provider (Database): 国立情報学研究所 : 学術機関リポジトリデータベース（IRDB）（機関リポジトリ）
https://irdb.nii.ac.jp
Original Data Provider (Database): 宇宙航空研究開発機構 : 宇宙航空研究開発機構リポジトリ