Advances in interconnection and packaging : International symposium : Nov 1990, Boston, MA. (SPIE Proceedings ; 1390)

Advances in interconnection and packaging : International symposium : Nov 1990, Boston, MA.

(SPIE Proceedings ; 1390)

Notes on use

Note (General)：: Papers.In 2 vols. This call number corresponds to bk 2 entitled: Microelectronic interconnects and packages, system and process integration.Index term...

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Material Type: 図書
ISBN: 0819404578
Title: Advances in interconnection and packaging : International symposium : Nov 1990, Boston, MA.
Series Title: SPIE Proceedings ; 1390
Author Heading: SPIE-The International Society for Optical Engineering.
Publication, Distribution, etc.: SPIE
Publication Date: 1991.
Publication Date (W3CDTF): 1991
Extent: v.
Alternative Title: In 2 vols. This call number corresponds to bk 2 entitled: Microelectronic interconnects and packages, system and process integration
microelectronic interconnects ; interconnection ; packaging ; SPIE
NDLC: M17
ND
Note (General): Papers.
In 2 vols. This call number corresponds to bk 2 entitled: Microelectronic interconnects and packages, system and process integration.
Index term: microelectronic interconnects ; interconnection ; packaging ; SPIE.
BL shelfmark: 6823.100 vol 1390 1990.
Holding library: 国立国会図書館
Call No.: M17-91-1479
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000003482868
http://id.ndl.go.jp/bib/000003482868
UKMARC No.: G01689454
Bibliographic Record Category (NDL): 215