Mechanics and materials for electronic packaging : Symposia : International mechanical engineering congress and exposition : Nov 1994, Chicago, IL. (AMD ; 187,193,195)

Mechanics and materials for electronic packaging : Symposia : International mechanical engineering congress and exposition : Nov 1994, Chicago, IL.

(AMD ; 187,193,195)

Call No. (NDL): M17-95-1207
Bibliographic ID of National Diet Library: 000003497621

Material type: 図書

Author: American Society of Mechanical Engineers. Applied Mechanics Division.ほか

Publisher: ASME

Publication date: 1994.

Material Format: Paper

Capacity, size, etc.: v.

NDC: -

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Notes on use

Note (General)：: Papers.In 3 vols. Vol 1:Design and process issues in electronic packaging. Also contains the Symposia papers on reliability and NDE issues in electron...

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Paper

Material Type: 図書
ISBN: 0791814491 (vol 1 : pbk)
0791814270 (vol 2 : pbk)
0791814424 (vol 3 : pbk)
Title: Mechanics and materials for electronic packaging : Symposia : International mechanical engineering congress and exposition : Nov 1994, Chicago, IL.
Series Title: AMD ; 187,193,195
Author Heading: American Society of Mechanical Engineers. Applied Mechanics Division.
American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
American Society of Mechanical Engineers. Materials Division.
American Society of Mechanical Engineers. Production Engineering Division.
Japan Society of Mechanical Engineers (JSME) . Materials and Mechanics Division.
Japan Society of Mechanical Engineers (JSME) . Computational Mechanics Division.
Publication, Distribution, etc.: ASME
Publication Date: 1994.
Publication Date (W3CDTF): 1994
Extent: v.
Alternative Title: In 3 vols. Vol 1: Design and process issues in electronic packaging. Also contains the Symposia papers on reliability and NDE issues in electronic packaging, and automotive packaging. Vol 2: Thermal and mechanical behavior and modeling. Vol 3: Coupled field behavior in materials
electronic packaging ; ASME ; mechanics ; materials ; mechanical engineering
NDLC: M17
ND
Note (General): Papers.
In 3 vols. Vol 1:Design and process issues in electronic packaging. Also contains the Symposia papers on reliability and NDE issues in electronic packaging, and automotive packaging. Vol 2: Thermal and mechanical behavior and modeling. Vol 3: Coupled field behavior in materials.
Index term: electronic packaging ; ASME ; mechanics ; materials ; mechanical engineering.
BL shelfmark: 1745.220 vols 187, 193 and 195 1994.
Holding library: 国立国会図書館
Call No.: M17-95-1207
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000003497621
http://id.ndl.go.jp/bib/000003497621
UKMARC No.: G02434966
Bibliographic Record Category (NDL): 215