Multichip modules and high density packaging : 7th International conference and exhibition : Apr 1998, Denver, CO.

• Material Type: 図書
• ISBN: 0780348508 (softbound); 0780348516 (microfiche)
• Title: Multichip modules and high density packaging : 7th International conference and exhibition : Apr 1998, Denver, CO.
• Author Heading: International Microelectronics and Packaging Society.; Institute of Electrical and Electronics Engineers. Components, Packaging, Manufacturing Technology Society (CPMT); Electronic Industries Association (EIA)
• Publication, Distribution, etc.: [New York] : Institute of Electrical and Electronics Engineers
• Publication Date: 1998.
• Publication Date (W3CDTF): 1998
• Extent: v.
• Alternative Title: Also Known as MCM 98. IEEE cat no 98EX154; multichip modules ; high density packaging ; IMAPS ; MCM ; IEEE
• NDLC: M17; ND
• Note (General): Papers.; Also Known as MCM 98. IEEE cat no 98EX154.; Index term: multichip modules ; high density packaging ; IMAPS ; MCM ; IEEE.; BL shelfmark: 4538.838347 7th 1998.
• Holding library: 国立国会図書館
• Call No.: M17-99-0519
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 000003508104; http://id.ndl.go.jp/bib/000003508104
• UKMARC No.: G05652941
• Bibliographic Record Category (NDL): 215