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図書

Low cost solder bumped flip chip technologies for direct chip attach (DCA) and chip scale package (CSP) : Course : May 1998, Singapore.

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Low cost solder bumped flip chip technologies for direct chip attach (DCA) and chip scale package (CSP) : Course : May 1998, Singapore.

Call No. (NDL)
M17-99-1949
Bibliographic ID of National Diet Library
000003509506
Material type
図書
Author
Semiconductor Equipment and Materials International (SEMI)
Publisher
-
Publication date
-
Material Format
Paper
Capacity, size, etc.
v.
NDC
-
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Notes on use

Note (General)：

Papers.Held at SEMICON Singapore 98 test, assembly & packaging technical symposium.Index term: SEMICON Singapore ; direct chip attach ; low cost solde...

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Paper

Material Type
図書
Title
Low cost solder bumped flip chip technologies for direct chip attach (DCA) and chip scale package (CSP) : Course : May 1998, Singapore.
Author Heading
Semiconductor Equipment and Materials International (SEMI)
Extent
v.
Alternative Title
Held at SEMICON Singapore 98 test, assembly & packaging technical symposium
SEMICON Singapore ; direct chip attach ; low cost solder bumped flip chip technologies ; chip scale package
NDLC
M17
ND
Note (General)
Papers.
Held at SEMICON Singapore 98 test, assembly & packaging technical symposium.
Index term: SEMICON Singapore ; direct chip attach ; low cost solder bumped flip chip technologies ; chip scale package.
Holding library
国立国会図書館
Call No.
M17-99-1949
Data Provider (Database)
国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp