Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology -- 2002 : presented at the 2002 ASME international mechanical engineering congress and exposition : November 17-22, 2002, New Orleans, Louisiana. : EPP : Nov 2002, New Orleans, LA. (EPP ; 2)

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology -- 2002 : presented at the 2002 ASME international mechanical engineering congress and exposition : November 17-22, 2002, New Orleans, Louisiana. : EPP : Nov 2002, New Orleans, LA.

(EPP ; 2)

Call No. (NDL): M17-03-1043
Bibliographic ID of National Diet Library: 000004096969

Material type: 図書

Author: International Mechanical Engineering Congress and Exposition (2002 : New Orleans, LA.)

Publisher: American Society of Mechanical Engineers

Publication date: c2002.

Material Format: Paper

Capacity, size, etc.: xiii, 572 p. : ill. ; 28 cm.

NDC: -

View All

Notes on use

Note (General)：: Papers.

Search by Bookstore

Bibliographic Record

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Paper

Material Type: 図書
ISBN: 0791836487
Title: Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology -- 2002 : presented at the 2002 ASME international mechanical engineering congress and exposition : November 17-22, 2002, New Orleans, Louisiana. : EPP : Nov 2002, New Orleans, LA.
Series Title: EPP ; 2
Title Heading: EPP (Series) ; v. 2.
Author Heading: International Mechanical Engineering Congress and Exposition (2002 : New Orleans, LA.)
Publication, Distribution, etc.: New York : American Society of Mechanical Engineers
Publication Date: c2002.
Publication Date (W3CDTF): 2002
Extent: xiii, 572 p. : ill. ; 28 cm.
Place of Publication (Country Code): US
Text Language Code: eng
Subject Heading: Electronic packaging -- Congresses.
Photonics -- Congresses.
Nanotechnology -- Congresses.
Microelectronic packaging -- Congresses.
Surface mount technology -- Congresses.
Microelectromechanical systems -- Congresses.
Integrated circuits -- Wafer-scale integration -- Congresses.
NDLC: M17
Note (General): Papers.
Note (Bibliography): Includes bibliographical references and author index.
Holding library: 国立国会図書館
Call No.: M17-03-1043
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000004096969
http://id.ndl.go.jp/bib/000004096969
RLIN No.: CUBGGLAD184991087-B
Bibliographic Record Category (NDL): 215