Evaluation and improvement of microstructural and mechanical properties of Sn-Ag-Cu and Sn-Zn lead-free solders and of their joints

Notes on use

Search by Bookstore

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Material Type: 博士論文
Title: Evaluation and improvement of microstructural and mechanical properties of Sn-Ag-Cu and Sn-Zn lead-free solders and of their joints
Author/Editor: Keun-Soo Kim [著]
Author Heading: 金, 槿銖キム, グンス
Publication, Distribution, etc.: [Keun-Soo Kim]
Publication Date: 2003
Publication Date (W3CDTF): 2003
Extent: 1冊
Alternative Title: 錫-銀-銅系と錫-亜鉛系鉛フリーはんだの微細組織と機械的特性の評価および改善スズ - ギン - ドウケイトスズ - アエンケイナマリフリーハンダノビサイソシキトキカイテキトクセイノヒョウカオヨビカイゼン
Degree grantor/type: 大阪大学
Date Granted: 平成15年3月25日
Date Granted (W3CDTF): 2003
Dissertation Number: 甲第9190号
Degree Type: 博士 (工学)
Note (Dissertation): 博士論文
Place of Publication (Country Code): JP
Text Language Code: eng
Alias of Author: Kim, Keun-Soo
NDLC: UT51
Note (General): 博士論文
Holding library: 国立国会図書館
Call No.: UT51-2003-E643
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000004137366
http://id.ndl.go.jp/bib/000004137366
Bibliographic Record Category (NDL): 213