Thermal deformation analysis of electronic packages by moire interferometry and phase-shifting method

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Material Type: 博士論文
Title: Thermal deformation analysis of electronic packages by moire interferometry and phase-shifting method
Author/Editor: Yasuyuki Morita [著]
Author Heading: 森田, 康之モリタ, ヤスユキ
Publication, Distribution, etc.: [Yasuyuki Morita]
Publication Date: [2003]
Publication Date (W3CDTF): 2003
Extent: 1冊
Alternative Title: モアレ干渉法と位相シフト法による電子パッケージの熱変形解析に関する研究モアレカンショウホウトイソウシフトホウニヨルデンシパッケージノネツヘンケイカイセキニカンスルケンキュウ
Degree grantor/type: 九州大学
Date Granted: 平成15年3月25日
Date Granted (W3CDTF): 2003
Dissertation Number: 甲第6487号
Degree Type: 博士 (工学)
Note (Dissertation): 博士論文
Place of Publication (Country Code): JP
Text Language Code: eng
NDLC: UT51
Note (General): 博士論文
Holding library: 国立国会図書館
Call No.: UT51-2003-G718
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000004180935
http://id.ndl.go.jp/bib/000004180935
Bibliographic Record Category (NDL): 213