First international IEEE conference on polymers and adhesives in microelectronics and photonics : incorporating POLY, PEP & Adhesives in Electronics : proceedings : presented at POLYTRONIC 2001 : Potsdam Germany : October 21-24, 2001. : Oct 2001, Potsdam, Germany.

First international IEEE conference on polymers and adhesives in microelectronics and photonics : incorporating POLY, PEP & Adhesives in Electronics : proceedings : presented at POLYTRONIC 2001 : Potsdam Germany : October 21-24, 2001. : Oct 2001, Potsdam, Germany.

Call No. (NDL): M17-03-5036
Bibliographic ID of National Diet Library: 000004204055

Material type: 図書

Author: Aschenbrenner, Rolf.ほか

Publisher: IEEE

Publication date: c2001.

Material Format: Paper

Capacity, size, etc.: xv, 376 p. : ill. ; 30 cm.

NDC: -

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Note (General)：: Papers."This new joint conference incorporates Polymeric Materials for Microelectronics and Photonics Application (POLY) , Adhesives in Electronics an...

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Paper

Material Type: 図書
ISBN: 0780372204 (souftbound ed.)
Title: First international IEEE conference on polymers and adhesives in microelectronics and photonics : incorporating POLY, PEP & Adhesives in Electronics : proceedings : presented at POLYTRONIC 2001 : Potsdam Germany : October 21-24, 2001. : Oct 2001, Potsdam, Germany.
Author Heading: Aschenbrenner, Rolf.
International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (1st : 2001 : Potsdam, Germany)
Publication, Distribution, etc.: Piscataway : IEEE
Publication Date: c2001.
Publication Date (W3CDTF): 2001
Extent: xv, 376 p. : ill. ; 30 cm.
Alternative Title: 1st international IEEE conference on polymers and adhesives in microelectronics and photonics : incorporating POLY, PEP and Adhesives in Electronics : proceedings : presented at POLYTRONIC 2001 : Potsdam Germany : October 21-24, 2001
Place of Publication (Country Code): US
Text Language Code: eng
Subject Heading: Polymers. -- Congresses.
Microelectronic packaging -- Materials -- Congresses.
Integrated circuits -- Reliability. -- Congresses.
Photonics -- Materials -- Congresses.
Polymeric composites. -- Congresses.
LCC: TK7871.15.P6
NDLC: M17
Note (General): Papers.
"This new joint conference incorporates Polymeric Materials for Microelectronics and Photonics Application (POLY) , Adhesives in Electronics and Polymeric Electronics Packaging (PEP) , " -- foreword.
IEEE cat no 01TH8592.
Note (Bibliography): Includes bibliographic references and author index.
Holding library: 国立国会図書館
Call No.: M17-03-5036
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000004204055
http://id.ndl.go.jp/bib/000004204055
LC Control Number: 2001094526
https://lccn.loc.gov/2001094526
RLIN No.: MOHG48947628-B
Bibliographic Record Category (NDL): 215