Proceedings of the 3rd international symposium on electronics materials and packaging 2001 : November 19-22, 2001 : Jeju Island, Korea. : Nov 2001, Jeju, Korea.

• Material Type: 図書
• ISBN: 0780371577
• Title: Proceedings of the 3rd international symposium on electronics materials and packaging 2001 : November 19-22, 2001 : Jeju Island, Korea. : Nov 2001, Jeju, Korea.
• Author Heading: Korea Advanced Institute of Science and Technology.; Lee, S. B.; Paik, K. W.; International Symposium on Electronic Materials and Packaging (3rd : 2001 : Jeju Island, Korea)
• Publication, Distribution, etc.: Piscataway : IEEE
• Publication Date: c2001.
• Publication Date (W3CDTF): 2001
• Extent: xviii, 449 p. : ill. ; 28 cm.
• Alternative Title: Advances in electronic materials and packaging 2001; EMAP 2001
• Place of Publication (Country Code): US
• Text Language Code: eng
• Subject Heading: Electronic packaging -- Congresses.; Internet resources.
• NDLC: M17
• Note (General): Program and papers.; IEEE cat no 01EX506.; Includes advertising material.; Related URL: http: //ieeexplore.ieee.org/lpdocs/epic03/RecentCon.htm?punumber=7725.
• Note (Bibliography): Includes bibliographical references and author index.
• Note (Additional Physical Form Available): Also available on the Internet to registered users via the IEEE web site under title: Electronic Materials and Packaging, 2001. EMAP 2001. Advances in.
• Holding library: 国立国会図書館
• Call No.: M17-03-4200
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 000004223192; http://id.ndl.go.jp/bib/000004223192
• LC Control Number: 2001092109; https://lccn.loc.gov/2001092109
• RLIN No.: CSUGA4733257-B
• Bibliographic Record Category (NDL): 215