International symposium on electronic materials and packaging (EMAP2000) : November 30-December 2, 2000, Hong Kong. : Nov 2000, Hong Kong, China.

• Material Type: 図書
• ISBN: 0780366549 (softbound ed.)
• Title: International symposium on electronic materials and packaging (EMAP2000) : November 30-December 2, 2000, Hong Kong. : Nov 2000, Hong Kong, China.
• Author Heading: Hong Kong University of Science and Technology. Dept. of Mechanical Engineering.; Hong Kong University of Science and Technology. EPACK Lab.; International Symposium on Electronic Materials and Packaging (2000 : Hong Kong, China)
• Publication, Distribution, etc.: Piscataway : IEEE
• Publication Date: c2000.
• Publication Date (W3CDTF): 2000
• Extent: xii, 478 p. : ill. ; 30 cm.
• Alternative Title: Proceedings of international symposium on electronic materials and packaging : EMAP2000 : November 30-December 2, 2000 : Hong Kong University of Science and Technology : Clear Water Bay, Kowloon, Hong Kong
• Place of Publication (Country Code): US
• Text Language Code: eng
• Subject Heading: Electronic packaging -- Congresses.
• NDLC: M17
• Note (General): Papers.; IEEE cat no 00EX458.
• Note (Bibliography): Includes bibliographical references.
• Holding library: 国立国会図書館
• Call No.: M17-03-4871
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 000004246558; http://id.ndl.go.jp/bib/000004246558
• LC Control Number: 00110269; https://lccn.loc.gov/00110269
• RLIN No.: MIUGBBG8553-B
• Bibliographic Record Category (NDL): 215