Chemical mechanical planarization 4 : proceedings of the international symposium. : 4th international symposium on chemical mechanical planarization (CMP) in integrated circuit (IC) device manufacturing : 198th meeting of the Electrochemical Society : Oct 2000, Phoenix, AZ. (PV ; 2000-26)

Chemical mechanical planarization 4 : proceedings of the international symposium. : 4th international symposium on chemical mechanical planarization (CMP) in integrated circuit (IC) device manufacturing : 198th meeting of the Electrochemical Society : Oct 2000, Phoenix, AZ.

(PV ; 2000-26)

Call No. (NDL): M17-03-4964
Bibliographic ID of National Diet Library: 000004248115

Material type: 図書

Author: Electrochemical Society.ほか

Publisher: Electrochemical Society

Publication date: c2001.

Material Format: Paper

Capacity, size, etc.: viii, 338 p. : ill. ; 24 cm.

NDC: -

View All

Notes on use

Note (General)：: Papers."Proceedings of the Fourth International Symposium on Chemical Mechanical Planarization (CMP) in Integrated Circuit (IC) Device Manufacturing h...

Search by Bookstore

Bibliographic Record

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Paper

Material Type: 図書
ISBN: 1566772931
Title: Chemical mechanical planarization 4 : proceedings of the international symposium. : 4th international symposium on chemical mechanical planarization (CMP) in integrated circuit (IC) device manufacturing : 198th meeting of the Electrochemical Society : Oct 2000, Phoenix, AZ.
Series Title: PV ; 2000-26
Title Heading: Proceedings (Electrochemical Society) ; v. 2000-26.
Author Heading: Electrochemical Society.
Opila, R. L.
Electrochemical Society. Meeting (198th : 2000 : Phoenix, Ariz.)
International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (4th : 2000 : Phoenix, Ariz.)
Publication, Distribution, etc.: Pennington : Electrochemical Society
Publication Date: c2001.
Publication Date (W3CDTF): 2001
Extent: viii, 338 p. : ill. ; 24 cm.
Place of Publication (Country Code): US
Text Language Code: eng
Subject Heading: Microelectronics -- Materials -- Congresses.
Grinding and polishing -- Congresses.
Metals -- Pickling -- Congresses.
Integrated circuits -- Materials -- Congresses.
NDLC: M17
Note (General): Papers.
"Proceedings of the Fourth International Symposium on Chemical Mechanical Planarization (CMP) in Integrated Circuit (IC) Device Manufacturing held at the 198th Meeting of the Electrochemical Society held in Phoeniz, AZ from October 23 to October 25, 2000." -- p. iii.
"Dielectric Science and Technology and Electronics Divisions" -- t. p.
Note (Bibliography): Includes bibliographical references and indexes.
Holding library: 国立国会図書館
Call No.: M17-03-4964
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000004248115
http://id.ndl.go.jp/bib/000004248115
LC Control Number: 2001086381
https://lccn.loc.gov/2001086381
RLIN No.: CUBGGLAD84538327-B
Bibliographic Record Category (NDL): 215