Semiconductor wafer bonding 7: science, technology, and applications : proceedings of the international symposium. : April 2003, Paris, France.

• Material Type: 図書
• ISBN: 1566774020
• Title: Semiconductor wafer bonding 7: science, technology, and applications : proceedings of the international symposium. : April 2003, Paris, France.
• Series Title: PV ; 2003-19
• Title Heading: Proceedings (Electrochemical Society) v. 2003-19.
• Author Heading: Bengtsson, Stefan.; Electrochemical Society. Meeting (2003 : Paris, France); International Symposium on Semiconductor Wafer Bonding (7th : 2003 : Paris, France)
• Publication, Distribution, etc.: Pennington : Electrochemical Society
• Publication Date: c2003.
• Publication Date (W3CDTF): 2003
• Extent: ix, 390 p. : ill. ; 24 cm.
• Place of Publication (Country Code): US
• Text Language Code: eng
• Subject Heading: Semiconductors -- Bonding. -- Congresses.; Semiconductor wafers -- Congresses.; Microelectromechanical systems -- Design and construction -- Congresses.
• NDLC: M17
• Note (General): Papers.; "The Seventh International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications was held in April/May 2003 in Paris, France, as a part of the 2003 Spring Meeting of the Electrochemical Society." -- p. iii.
• Note (Bibliography): Includes bibliographic references and indexes.
• Holding library: 国立国会図書館
• Call No.: M17-04-1879
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 000004382103; http://id.ndl.go.jp/bib/000004382103
• LC Control Number: 2003115444; https://lccn.loc.gov/2003115444
• RLIN No.: MOHG54433378-B
• Bibliographic Record Category (NDL): 215