Chemical Compatibility Issues Related to Use of Copper as an Interfacial Layer for SiC Fiber Reinforced Ti3Ai+NB Composite. Final Report NASA-CR-187100 N91-25194 NAS-126187100 E-6143

Chemical Compatibility Issues Related to Use of Copper as an Interfacial Layer for SiC Fiber Reinforced Ti3Ai+NB Composite. Final Report

NASA-CR-187100 N91-25194 NAS-126187100 E-6143

Call No. (NDL): LS-N91/25194
Bibliographic ID of National Diet Library: 000004950552

Material type: 規格・テクニカルリポート類

Author: Misra, A. K

Publisher: -

Publication date: -

Material Format: Microform

Capacity, size, etc.: microfiche 20 p

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Material Type: 規格・テクニカルリポート類
Title: Chemical Compatibility Issues Related to Use of Copper as an Interfacial Layer for SiC Fiber Reinforced Ti3Ai+NB Composite. Final Report
Author/Editor: Misra, A. K
Extent: microfiche 20 p
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : NASA-CR-187100
テクニカルリポート番号 : N91-25194
テクニカルリポート番号 : NAS-126187100
テクニカルリポート番号 : E-6143
Holding library: 国立国会図書館
Call No.: LS-N91/25194
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000004950552
http://id.ndl.go.jp/bib/000004950552
Bibliographic Record Category (NDL): 291