Plastic deformation of solder joints in pin grid arrays subjected to thermal stress ASME-94-WA/EEP-3

Plastic deformation of solder joints in pin grid arrays subjected to thermal stress

ASME-94-WA/EEP-3

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Material Type: 規格・テクニカルリポート類
Title: Plastic deformation of solder joints in pin grid arrays subjected to thermal stress
Author/Editor: Engel, Peter
Chou, Shou-Chien
Publication Date: 1994
Publication Date (W3CDTF): 1994
Extent: 15 p
Alternative Title: International mechanical engineering congress & exhibition, of the winter annual meeting. Chicago, Ill. Nov. 1994
Report No.: テクニカルリポート番号 : ASME-94-WA/EEP-3
Holding library: 国立国会図書館
Call No.: M-ASME-94-WA/EEP-3
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005501141
http://id.ndl.go.jp/bib/000005501141
Bibliographic Record Category (NDL): 291