Characterization and electrical properties of copper films grown via direct liquid coinjection of (hfac)Cu(TMVS) and TMVS SAND-94-1716 DE95 002957

Characterization and electrical properties of copper films grown via direct liquid coinjection of (hfac)Cu(TMVS) and TMVS

SAND-94-1716 DE95 002957

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Material Type: 規格・テクニカルリポート類
Title: Characterization and electrical properties of copper films grown via direct liquid coinjection of (hfac)Cu(TMVS) and TMVS
Author/Editor: Parmeter, J. E
Petersn, G. A
Apblett, C. A
Smith, P. M
Publication Date: 1994
Publication Date (W3CDTF): 1994
Extent: 30 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : SAND-94-1716
テクニカルリポート番号 : DE95 002957
Holding library: 国立国会図書館
Call No.: LS-DE95/002957
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005511331
http://id.ndl.go.jp/bib/000005511331
Bibliographic Record Category (NDL): 291