Copper CVD using liquid coinjection of (hfac)Cu(TMVS) and TMVS SAND-94-2544C DE95 008155 CONF-94101781

Copper CVD using liquid coinjection of (hfac)Cu(TMVS) and TMVS

SAND-94-2544C DE95 008155 CONF-94101781

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Material Type: 規格・テクニカルリポート類
Title: Copper CVD using liquid coinjection of (hfac)Cu(TMVS) and TMVS
Author/Editor: Custer, J. S
Petersen, G. A
Smith, P. M
Parmeter, J. E
Apblett, C. A
Publication Date: 1994
Publication Date (W3CDTF): 1994
Extent: 5 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : SAND-94-2544C
テクニカルリポート番号 : DE95 008155
テクニカルリポート番号 : CONF-94101781
Holding library: 国立国会図書館
Call No.: LS-DE95/008155
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005518091
http://id.ndl.go.jp/bib/000005518091
Bibliographic Record Category (NDL): 291