Microstructural image analysis based finite element model for effective thermal conductivity of filled polymeric composites ASME-95-WA/HT-27

Microstructural image analysis based finite element model for effective thermal conductivity of filled polymeric composites

ASME-95-WA/HT-27

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Material Type: 規格・テクニカルリポート類
Title: Microstructural image analysis based finite element model for effective thermal conductivity of filled polymeric composites
Author/Editor: Ramani, Karthik
Vaidyanathan, Aparna
Publication Date: 1995
Publication Date (W3CDTF): 1995
Extent: 17 p
Alternative Title: ASME international mechanical engineering congress & exposition. San Francisco, Calif. Nov. 1995
Report No.: テクニカルリポート番号 : ASME-95-WA/HT-27
Holding library: 国立国会図書館
Call No.: M-ASME-95-WA/HT-27
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005519075
http://id.ndl.go.jp/bib/000005519075
Bibliographic Record Category (NDL): 291