Application of integrated matrix creep of solder joint reliability prediction ASME-95-WA/EEP-2

Application of integrated matrix creep of solder joint reliability prediction

ASME-95-WA/EEP-2

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Material Type: 規格・テクニカルリポート類
Title: Application of integrated matrix creep of solder joint reliability prediction
Author/Editor: Iannuzzelli, Raymond J
Pitarresi, James M
Prakash, Veeramani
Publication Date: 1995
Publication Date (W3CDTF): 1995
Extent: 16 p
Alternative Title: ASME international mechanical engineering congress & exposition. San Francisco, Calif. Nov. 1995
Report No.: テクニカルリポート番号 : ASME-95-WA/EEP-2
Holding library: 国立国会図書館
Call No.: M-ASME-95-WA/EEP-2
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005519287
http://id.ndl.go.jp/bib/000005519287
Bibliographic Record Category (NDL): 291