A thermal fatigue failure mechanism of 58Bi-42Sn solder joints ASME-95-WA/EEP-4

A thermal fatigue failure mechanism of 58Bi-42Sn solder joints

ASME-95-WA/EEP-4

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Material Type: 規格・テクニカルリポート類
Title: A thermal fatigue failure mechanism of 58Bi-42Sn solder joints
Author/Editor: Mei, Zequn
Holder, Helen
Publication Date: 1995
Publication Date (W3CDTF): 1995
Extent: 10 p
Alternative Title: ASME international mechanical engineering congress & exposition. San Francisco, Calif. Nov. 1995
Report No.: テクニカルリポート番号 : ASME-95-WA/EEP-4
Holding library: 国立国会図書館
Call No.: M-ASME-95-WA/EEP-4
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005519289
http://id.ndl.go.jp/bib/000005519289
Bibliographic Record Category (NDL): 291