Intermetallic compound layer growth kinetics in non-lead bearing solders SAND-95-0573C DE95 009595 CONF-95031192

Intermetallic compound layer growth kinetics in non-lead bearing solders

SAND-95-0573C DE95 009595 CONF-95031192

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Material Type: 規格・テクニカルリポート類
Title: Intermetallic compound layer growth kinetics in non-lead bearing solders
Author/Editor: Vianco, P. T
Kilgo, A. C
Grant, R
Publication Date: 1995
Publication Date (W3CDTF): 1995
Extent: 18 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : SAND-95-0573C
テクニカルリポート番号 : DE95 009595
テクニカルリポート番号 : CONF-95031192
Holding library: 国立国会図書館
Call No.: LS-DE95/009595
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005520078
http://id.ndl.go.jp/bib/000005520078
Bibliographic Record Category (NDL): 291