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規格・テクニカルリポート類

Solderability enhancement of copper through chemical etching SAND-95-0734C DE95 010514 CONF-95041421

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Solderability enhancement of copper through chemical etching

SAND-95-0734C DE95 010514 CONF-95041421

Call No. (NDL)
LS-DE95/010514
Bibliographic ID of National Diet Library
000005520654
Material type
規格・テクニカルリポート類
Author
Stevenson, J. Oほか
Publisher
-
Publication date
1995
Material Format
Microform
Capacity, size, etc.
16 p. (1 microfiche)
NDC
-
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Microform

Material Type
規格・テクニカルリポート類
Author/Editor
Stevenson, J. O
Guilinger, T. R
Hosking, F. M
Yost, F. G
Sorensen, N. R
Publication Date
1995
Publication Date (W3CDTF)
1995
Extent
16 p. (1 microfiche)
Note (Material Type)
[microform]
Report No.
テクニカルリポート番号 : SAND-95-0734C
テクニカルリポート番号 : DE95 010514
テクニカルリポート番号 : CONF-95041421
Holding library
国立国会図書館
Call No.
LS-DE95/010514