Influence of grain structure on the reliability of narrow Al- based interconnects UCRL-JC-120336 DE95 015883 CONF-95041232

Influence of grain structure on the reliability of narrow Al- based interconnects

UCRL-JC-120336 DE95 015883 CONF-95041232

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Material Type: 規格・テクニカルリポート類
Title: Influence of grain structure on the reliability of narrow Al- based interconnects
Author/Editor: Kang, S. H
Kim, C
Genin, F. Y
Publication Date: 1995
Publication Date (W3CDTF): 1995
Extent: 8 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : UCRL-JC-120336
テクニカルリポート番号 : DE95 015883
テクニカルリポート番号 : CONF-95041232
Holding library: 国立国会図書館
Call No.: LS-DE95/015883
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005533965
http://id.ndl.go.jp/bib/000005533965
Bibliographic Record Category (NDL): 291