Mechanism of electromigration failure in Al thin film interconnects containing Sc UCRL-JC-120337 DE95 015880 CONF-95041233

Mechanism of electromigration failure in Al thin film interconnects containing Sc

UCRL-JC-120337 DE95 015880 CONF-95041233

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Material Type: 規格・テクニカルリポート類
Title: Mechanism of electromigration failure in Al thin film interconnects containing Sc
Author/Editor: Kim, C
Kang, S. H
Morris, J. W
Genin, F. Y
Publication Date: 1995
Publication Date (W3CDTF): 1995
Extent: 8 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : UCRL-JC-120337
テクニカルリポート番号 : DE95 015880
テクニカルリポート番号 : CONF-95041233
Holding library: 国立国会図書館
Call No.: LS-DE95/015880
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005533966
http://id.ndl.go.jp/bib/000005533966
Bibliographic Record Category (NDL): 291