Analysis of near-field thermal and psychometric waste package environment using ventilation UCRL-JC-120957 DE95 015106 CONF-95041793

Analysis of near-field thermal and psychometric waste package environment using ventilation

UCRL-JC-120957 DE95 015106 CONF-95041793

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Material Type: 規格・テクニカルリポート類
Title: Analysis of near-field thermal and psychometric waste package environment using ventilation
Author/Editor: Danko, G
Buscheck, T. A
Nitao, J. J
Saterlie, S
Publication Date: 1995
Publication Date (W3CDTF): 1995
Extent: 10 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : UCRL-JC-120957
テクニカルリポート番号 : DE95 015106
テクニカルリポート番号 : CONF-95041793
Holding library: 国立国会図書館
Call No.: LS-DE95/015106
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005536330
http://id.ndl.go.jp/bib/000005536330
Bibliographic Record Category (NDL): 291