Aging, stressing and solderability of electroplated and electroless copper SAND-94-1451 DE95 017638

Aging, stressing and solderability of electroplated and electroless copper

SAND-94-1451 DE95 017638

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Material Type: 規格・テクニカルリポート類
Title: Aging, stressing and solderability of electroplated and electroless copper
Author/Editor: Sorensen, N. R
Hosking, F. M
Publication Date: 1995
Publication Date (W3CDTF): 1995
Extent: 15 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : SAND-94-1451
テクニカルリポート番号 : DE95 017638
Holding library: 国立国会図書館
Call No.: LS-DE95/017638
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005539362
http://id.ndl.go.jp/bib/000005539362
Bibliographic Record Category (NDL): 291