Adhesion studies of GaAs-based ohmic contact and bond pad metallization SAND-95-2117C DE96 008229 CONF-9604571

Adhesion studies of GaAs-based ohmic contact and bond pad metallization

SAND-95-2117C DE96 008229 CONF-9604571

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Material Type: 規格・テクニカルリポート類
Title: Adhesion studies of GaAs-based ohmic contact and bond pad metallization
Author/Editor: Seigal, P. K
Briggs, R. D
Rieger, D. J
Baca, A. G
Howard, A. J
Publication Date: 1996
Publication Date (W3CDTF): 1996
Extent: 11 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : SAND-95-2117C
テクニカルリポート番号 : DE96 008229
テクニカルリポート番号 : CONF-9604571
Holding library: 国立国会図書館
Call No.: LS-DE96/008229
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005775761
http://id.ndl.go.jp/bib/000005775761
Bibliographic Record Category (NDL): 291