Adhesive bonding via exposure to microwave radition and resulting mechanical evaluation CONF-960401-10 DE96 008655

Adhesive bonding via exposure to microwave radition and resulting mechanical evaluation

CONF-960401-10 DE96 008655

This page shows libraries in Japan other than the National Diet Library that hold the material.

Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.

other

Japan Atomic Energy Agency's Library Catalog
Paper
Japan Atomic Energy Agency's Library Catalog

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Material Type: 規格・テクニカルリポート類
Title: Adhesive bonding via exposure to microwave radition and resulting mechanical evaluation
Author/Editor: Paulauskas, F. L
Warren, C. D
Meek, T. T
Publication Date: 1996
Publication Date (W3CDTF): 1996
Extent: 14 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : CONF-960401-10
テクニカルリポート番号 : DE96 008655
Holding library: 国立国会図書館
Call No.: LS-DE96/008655
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005776329
http://id.ndl.go.jp/bib/000005776329
Bibliographic Record Category (NDL): 291