Stress level evaluation of thin films under thermal loading from a brazing process ANL/XFD/CP-89334 DE96 011152 CONF-96070618

Stress level evaluation of thin films under thermal loading from a brazing process

ANL/XFD/CP-89334 DE96 011152 CONF-96070618

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Material Type: 規格・テクニカルリポート類
Title: Stress level evaluation of thin films under thermal loading from a brazing process
Author/Editor: Wang, Z
Kuzay, T. M
Publication Date: 1996
Publication Date (W3CDTF): 1996
Extent: 10 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : ANL/XFD/CP-89334
テクニカルリポート番号 : DE96 011152
テクニカルリポート番号 : CONF-96070618
Holding library: 国立国会図書館
Call No.: LS-DE96/011152
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005856074
http://id.ndl.go.jp/bib/000005856074
Bibliographic Record Category (NDL): 291