Quantitative prediction of stresses during thermoset cure SAND-96-1589C DE96 011718 CONF-9607864

Quantitative prediction of stresses during thermoset cure

SAND-96-1589C DE96 011718 CONF-9607864

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Material Type: 規格・テクニカルリポート類
Title: Quantitative prediction of stresses during thermoset cure
Author/Editor: Adolf, D
Chambers, B
Burchett, S
Publication Date: 1996
Publication Date (W3CDTF): 1996
Extent: 2 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : SAND-96-1589C
テクニカルリポート番号 : DE96 011718
テクニカルリポート番号 : CONF-9607864
Holding library: 国立国会図書館
Call No.: LS-DE96/011718
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005857957
http://id.ndl.go.jp/bib/000005857957
Bibliographic Record Category (NDL): 291