規格・テクニカルリポート類

Computational modeling of direct molten solder delivery for ball grid array applications SAND-96-1857C DE96 006254 CONF-96092122

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Computational modeling of direct molten solder delivery for ball grid array applications

SAND-96-1857C DE96 006254 CONF-96092122

Call No. (NDL)
LS-DE96/006254
Bibliographic ID of National Diet Library
000005858775
Material type
規格・テクニカルリポート類
Author
Essien, Mほか
Publisher
-
Publication date
1996
Material Format
Microform
Capacity, size, etc.
4 p. (1 microfiche)
NDC
-
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Microform

Material Type
規格・テクニカルリポート類
Author/Editor
Essien, M
Frear, D
Sackinger, P
Publication Date
1996
Publication Date (W3CDTF)
1996
Extent
4 p. (1 microfiche)
Note (Material Type)
[microform]
Report No.
テクニカルリポート番号 : SAND-96-1857C
テクニカルリポート番号 : DE96 006254
テクニカルリポート番号 : CONF-96092122
Holding library
国立国会図書館
Call No.
LS-DE96/006254