Metallization and packaging of compound semiconductor devices at Sandia National Laboratories SAND-96-1415C DE96 013183 CONF-96101911

Metallization and packaging of compound semiconductor devices at Sandia National Laboratories

SAND-96-1415C DE96 013183 CONF-96101911

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Material Type: 規格・テクニカルリポート類
Title: Metallization and packaging of compound semiconductor devices at Sandia National Laboratories
Author/Editor: Seigal, P. K
Armendariz, M. G
Rieger, D. J
Lear, K. L
Sullivan, C. T
Publication Date: 1996
Publication Date (W3CDTF): 1996
Extent: 12 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : SAND-96-1415C
テクニカルリポート番号 : DE96 013183
テクニカルリポート番号 : CONF-96101911
Holding library: 国立国会図書館
Call No.: LS-DE96/013183
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005862760
http://id.ndl.go.jp/bib/000005862760
Bibliographic Record Category (NDL): 291