Material development of polymer/metal paste for flip-chip attach interconnection technology DOE/AL/98817-8-PT.1 DE97 000822

Material development of polymer/metal paste for flip-chip attach interconnection technology

DOE/AL/98817-8-PT.1 DE97 000822

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Material Type: 規格・テクニカルリポート類
Title: Material development of polymer/metal paste for flip-chip attach interconnection technology
Author/Editor: Roldann, J. M
Saraf, R. F
Sambucetti, C. J
Cotte, J
Publication Date: 1996
Publication Date (W3CDTF): 1996
Extent: 16 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : DOE/AL/98817-8-PT.1
テクニカルリポート番号 : DE97 000822
Holding library: 国立国会図書館
Call No.: LS-DE97/000822
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005863167
http://id.ndl.go.jp/bib/000005863167
Bibliographic Record Category (NDL): 291