Moisture and aging effects of solder wettability of copper surfaces SAND-96-2191C DE97 000889 CONF-96101431

Moisture and aging effects of solder wettability of copper surfaces

SAND-96-2191C DE97 000889 CONF-96101431

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Material Type: 規格・テクニカルリポート類
Title: Moisture and aging effects of solder wettability of copper surfaces
Author/Editor: Hernandez, C. L
Sorensen, N. R
Lucero, S. J
Publication Date: 1996
Publication Date (W3CDTF): 1996
Extent: 7 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : SAND-96-2191C
テクニカルリポート番号 : DE97 000889
テクニカルリポート番号 : CONF-96101431
Holding library: 国立国会図書館
Call No.: LS-DE97/000889
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005863850
http://id.ndl.go.jp/bib/000005863850
Bibliographic Record Category (NDL): 291