Computational continuum modeling of solder interconnects SAND-97-0382C DE97 003205 CONF-97020117

Computational continuum modeling of solder interconnects

SAND-97-0382C DE97 003205 CONF-97020117

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Material Type: 規格・テクニカルリポート類
Title: Computational continuum modeling of solder interconnects
Author/Editor: Burchett, S. N
Neilsen, M. K
Frear, D. R
Stephens, J. J
Publication Date: 1997
Publication Date (W3CDTF): 1997
Extent: 8 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : SAND-97-0382C
テクニカルリポート番号 : DE97 003205
テクニカルリポート番号 : CONF-97020117
Holding library: 国立国会図書館
Call No.: LS-DE97/003205
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005867220
http://id.ndl.go.jp/bib/000005867220
Bibliographic Record Category (NDL): 291