Solder joint realiability of plastic ball grid array with solder bumped flip chip ASME-97-WA/EEP-6

Solder joint realiability of plastic ball grid array with solder bumped flip chip

ASME-97-WA/EEP-6

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Material Type: 規格・テクニカルリポート類
Title: Solder joint realiability of plastic ball grid array with solder bumped flip chip
Author/Editor: Lee, S-W. Ricky
Lau, John H
Publication Date: 1997
Publication Date (W3CDTF): 1997
Extent: 8 p
Alternative Title: ASME international mechanical engineering congress & exposition. Dallas, Tex. Nov. 1997
Report No.: テクニカルリポート番号 : ASME-97-WA/EEP-6
Holding library: 国立国会図書館
Call No.: M-ASME-97-WA/EEP-6
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005868094
http://id.ndl.go.jp/bib/000005868094
Bibliographic Record Category (NDL): 291