Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method SAND-96-2616C DE97 003842 CONF-9705692

Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method

SAND-96-2616C DE97 003842 CONF-9705692

Call No. (NDL): LS-DE97/003842
Bibliographic ID of National Diet Library: 000005869408

Material type: 規格・テクニカルリポート類

Author: Peterson, D. Wほか

Publisher: -

Publication date: 1996

Material Format: Microform

Capacity, size, etc.: 15 p. (1 microfiche)

NDC: -

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Microform

Material Type: 規格・テクニカルリポート類
Title: Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method
Author/Editor: Peterson, D. W
Sweet, J. N
Burchett, S. N
Hsia, A
Publication Date: 1996
Publication Date (W3CDTF): 1996
Extent: 15 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : SAND-96-2616C
テクニカルリポート番号 : DE97 003842
テクニカルリポート番号 : CONF-9705692
Holding library: 国立国会図書館
Call No.: LS-DE97/003842
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005869408
http://id.ndl.go.jp/bib/000005869408
Bibliographic Record Category (NDL): 291