Deep high-aspect ratio Si etching for advanced packaging technologies SAND980608C DE98 003344

Deep high-aspect ratio Si etching for advanced packaging technologies

SAND980608C DE98 003344

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Material Type: 規格・テクニカルリポート類
Title: Deep high-aspect ratio Si etching for advanced packaging technologies
Author/Editor: Shul, R. J
Willison, C. G
Sullivan, C. T
Kravitz, S. H
Zhang, L
Publication Date: 1998
Publication Date (W3CDTF): 1998
Extent: 12 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : SAND980608C
テクニカルリポート番号 : DE98 003344
Holding library: 国立国会図書館
Call No.: LS-DE98/003344
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005909201
http://id.ndl.go.jp/bib/000005909201
Bibliographic Record Category (NDL): 291